Thermal & Power Management

For compact wearable electronics, Parker's thermal and power management technologies help manage heat while supporting user comfort and device reliability.

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Thermally Conductive Adhesive Tapes

Parker Chomerics THERMATTACH® tapes are formulated with acrylic or silicone based pressure sensitive adhesive (PSA) loaded with thermally conductive fillers. They are designed to securely bond heat sinks to power dissipating components without an additional clamping mechanism. View Product

Thermally Conductive Gels

Discover which Parker Chomerics THERM-A-GAP™ GEL is best for your application. These single component dispensable thermal gap fillers require no curing and can be dispensed over a heat generating component for effective cooling. THERM-A-GAP GELs eliminate multiple thermal gap filler pad part sizes and their cross-linked gel structure provides superior long-term thermal stability and performance. View Product

Thermal Cure-in-Place Potting & Underfill Materials

Parker Chomerics THERM-A-FORM cure-in-place compounds are dispensable liquid reactive materials designed to transfer heat from complex or multi-height electronic components on a PCB without requiring expensive custom-molded sheets or imposing excessive compressive force. View Product