Thermal & Power Management

Parker's thermal and power management solutions help chillers deliver stable cooling for facilities and electronic equipment.

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Thermally Conductive Gels

Discover which Parker Chomerics THERM-A-GAP™ GEL is best for your application. These single component dispensable thermal gap fillers require no curing and can be dispensed over a heat generating component for effective cooling. THERM-A-GAP GELs eliminate multiple thermal gap filler pad part sizes and their cross-linked gel structure provides superior long-term thermal stability and performance. View Product

Thermally Conductive Pads

Parker Chomerics THERM-A-GAP™ gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface. View Product