Thermal & Power Management

Thermal and power management Parker solutions help control heat and support reliable network equipment performance.

Contact Us

Thermally Conductive Gels

Discover which Parker Chomerics THERM-A-GAP™ GEL is best for your application. These single component dispensable thermal gap fillers require no curing and can be dispensed over a heat generating component for effective cooling. THERM-A-GAP GELs eliminate multiple thermal gap filler pad part sizes and their cross-linked gel structure provides superior long-term thermal stability and performance. View Product

Thermally Conductive Phase Change Materials

Parker Chomerics THERMFLOW® phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability. View Product

Thermally Conductive Pads

Parker Chomerics THERM-A-GAP™ gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface. View Product