Thermal & Power Management

Parker's thermal and power management technologies help support reliable operation of compact wireless access equipment.

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Thermal Cure-in-Place Potting & Underfill Materials

Parker Chomerics THERM-A-FORM cure-in-place compounds are dispensable liquid reactive materials designed to transfer heat from complex or multi-height electronic components on a PCB without requiring expensive custom-molded sheets or imposing excessive compressive force. View Product

Thermally Conductive Pads

Parker Chomerics THERM-A-GAP™ gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface. View Product

Thermally Conductive Gels

Discover which Parker Chomerics THERM-A-GAP™ GEL is best for your application. These single component dispensable thermal gap fillers require no curing and can be dispensed over a heat generating component for effective cooling. THERM-A-GAP GELs eliminate multiple thermal gap filler pad part sizes and their cross-linked gel structure provides superior long-term thermal stability and performance. View Product